World Future
  • Home
  • About
  • ads.txt
Sign in Subscribe

memory chip packaging

A collection of 1 post
SIMMTECH's new Malaysia memory chip packaging substrate
memory chip packaging

SIMMTECH's new Malaysia memory chip packaging substrate

PENANG, May 9 — SIMMTECH, a South Korea-based global leading manufacturer for semiconductor packaging substrate and HDI Printed Circuit Board (PCB), is set to deliver the first Made in Malaysia memory chip packaging substrate through its subsidiary Sustio Sdn Bhd. held the grand opening ceremony for its Malaysia-based subsidiary, SUSTIO Sdn
10 May 2022 3 min read
Page 1 of 1
World Future © 2025
  • Sign up
Powered by Ghost